NanoWired

NANOWIRED INTERCONNECT TECHNOLOGY

01
Facility Standard
ISO 8
Cleanroom
02
Process Advantage
No CMP
Machine Required
50+
PATENTS FILED
60+
INDUSTRY PARTNERS
<1 μm
WIRE DIAMETER
2017
FOUNDED · TU DARMSTADT
Advanced Interconnect Technology

Room-Temperature Nanowire Interconnects for Next-Generation Packaging

Electrochemically grown nanowires enable ultra-high-density semiconductor interconnects without CMP steps, high-temperature bonding, or ultra-cleanroom dependency.

≤25°C
Bond Temperature
10⁸
Wires / cm²
Sub-μm
Alignment
die-attach
Why NanoWired GmbH?

Superior to Hybrid Bonding — in every key metric

NanoWired replaces high-temperature, ultra-cleanroom-dependent bonding with an electrochemical nanowire process operating at room temperature in ISO 8 environments.

Bond Temperature
≥ 200°C
≤ 25°C
Cleanroom Class
ISO 1–3
ISO 8
CMP Requirement
Required
Eliminated
Interconnect Density
~10⁶ / cm²
10⁸ / cm²
Alignment Precision
Sub-nm critical
Sub-μm sufficient
Thermal Sensitivity
Incompatible
Fully compatible
100×
Higher interconnect density
~175°C
Lower process temperature
0
CMP steps required
ISO 8
vs. ultra-cleanroom dependency
TEAM

Leadership & Advisory Board

FOUNDERS

Dr. Sebastian Quednau

Co-CEO · CTO (Technology)

Farough Roustaie

Co-CEO · CSO (Sales & Finance)

Florian Weissenborn

Co-CEO · COO & Customer Projects

Advisory Board

Alexander Wiegand

CEO · WIKA

Dr. Kazayuki Marukawa

CEO · JXM Frankfurt

Dr. Henk Randau

Freudenberg Performance Materials

Hong Wong

Managing Director

Get in Touch

Have a question or want to discuss a project? Reach out using the details below.

📍 Location: Emanuel-Merck-Straße 99, 64579 Gernsheim, Germany
📞 Phone: +49 XXX XXXXXXX
✉ Email: info@nanowired.de
🏢 Company: NanoWired GmbH

Nanowired GmbH

The most efficient way of connecting technology

Based in Gernsheim, Germany, working with partners and clients worldwide.